Ipc-9704 Pdf -

: Gages should be placed at the corners of critical components, like BGAs 27x27mm or larger, typically within 1.0mm of the component body edge. Measurement Equipment Simultaneous Sampling

IPC/JEDEC-9704 provides essential guidelines for measuring mechanical strain on PCBs during assembly to prevent solder joint fractures, particularly for BGAs. The standard dictates specific rosette strain gage usage and outlines critical monitoring steps like PCB routing, connector insertion, and ICT testing. For more technical specifications, visit JEDEC . ipc-9704 pdf

: Standardizes where and how to attach strain gages (typically near corners of large components like BGAs). Test Setup : Gages should be placed at the corners

The , officially titled the Printed Circuit Assembly Strain Gage Test Guideline , serves as the industry-standard methodology for measuring these mechanical stresses. By following this standard, manufacturers can quantitatively identify processes—like ICT testing or manual handling—that exceed safe strain limits and cause microscopic solder joint fractures before they reach the consumer. Overview of IPC/JEDEC-9704A For more technical specifications, visit JEDEC

IPC-9704 distinguishes between two major stress events: