In a standard test environment utilizing a USB 3.2 Gen 2x2 port and a PCIe Gen 3 x4 NVMe SSD:
Section D — Signal Integrity & Layout (15 points) rtl9210b datasheet
Empirical testing of the RTL9210B reveals a thermal design power (TDP) that requires consideration. Under sustained sequential loads (such as large file transfers), the controller can generate significant heat. Without a thermal pad connecting the chip to the enclosure casing, the RTL9210B has been observed to initiate thermal throttling, dropping transfer speeds from the 1,000 MB/s - 1,050 MB/s range down to lower thresholds to protect silicon integrity. In a standard test environment utilizing a USB 3